The LEXT OLS4000 has been developed to represent a new standard of surface roughness measuring tool. This system is calibrated in the same way contact surface roughness gauges are calibrated, and has the necessary roughness parameters and filters required per ISO and JQA. This allows users with contact surface roughness gauges to obtain output results from the system consistent with their existing instruments, with the advantage of greater speed and noncontact measurement. The LEXT OLS4000 has a new roughness-specific mode enabling roughness profile measurement for sample lengths up to 100 mm with the new automatic line stitching function.

Roughness Measurement GUI
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| Primary Profile from LEXT OLS4000 ?s=2.5 ?m without Filtering |
Primary Profile from LEXT OLS4000 ?s=2.5 ?m with Filtering |
Primary Profile from a Contact Surface Roughness Measuring Machine |
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LEXT OLS4000 Surface Profile Parameters List

LEXT OLS4000 Surface Roughness Parameters List
(Conforms to ISO25178 Draft)
Contact surface roughness measuring machines cannot measure micro asperities less than the stylus tip diameter. The laser microscope can measure the surface roughness of micro geometries at high resolution due to a minute laser spot diameter.

Contact Surface Roughness Measuring Machine

Laser Microscope
Since a contact surface roughness measuring machine uses a hard needle-shape stylus, it is more likely to scratch the surface of a soft specimen, damaging or deforming it. With adhesive specimens, on the other hand, the stylus could attach to the specimen and be damaged when pulled loose, making it impossible to obtain correct results. Laser microscopes, which are of a non-contact type, can perform accurate surface roughness measurement regardless of surface texture conditions.

Soft Specimen

Adhesive Specimen
Surface roughness measuring machines cannot measure micro areas since their stylus are not able to access these areas. Laser microscopes can correctly identify a measuring position and easily perform roughness measurement of a target micro area.

Bonding Wires